Realizes high quality and high speed processing of difficult-to-cut materials Targets for ultrasonic-wave processing Ultrasonic-wave processing aims to achieve good processing ...

Advanced resistivity control technology eliminates electrostatic charge in high-purity water. Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...

Unique filter design for low filtration running costs Designed for use next to a dicing saw Ultra-small footprint filtration system This unit recycles dicing/grinding water and ...

Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...

Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...